Sparse Pin Fin Heatsink

Sparse Pin Fin Heatsink

Designed for low airspeed environments and natural convection cooling (0-200 LFM)

A widely spaced pin design allows for efficient cooling in low airspeed environments

Overview

Sparsely configured pin fin heat sinks generate substantial cooling power in limited airspeed environments
The sparse pin fin configuration allows weak incoming air streams to efficiently enter and exit the pin array, thus providing efficient cooling in low airspeed environments

Sparsely configured pin fin heat sinks are highly suitable for heavily populated boards in which low pressure drop is an asset

Googe is committed to the provision of custom parts in a cost effective fashion, generally without any tooling or setup charges for footprint less than 70mmx70mm. Customizable parameters include length, width and height

Googe heat sinks are lapped in order to reduce the contact resistance between the heat sink and the device

Sparsely configured pin fin heat sinks range from a footprint of 15mm x 15mm to a footprint of 200mmx200mm and from a height of 5mm to a height of 40mm